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TechnologyA complete heat path
Most phone coolers blow air across the back of the device. This one moves the heat out of the phone entirely, through a semiconductor plate, a copper spreader, a liquid loop and a sealed reservoir.
Four steps, one direction
A Peltier element gets cold on one face and hot on the other. The cold face meets the copper sheet; the hot face hands heat to the cooling end.
A 3 mm copper sheet spreads the cold evenly across the full 5,308 mm² contact area instead of cooling one hotspot.
A micro pump pushes coolant through a flexible 95 cm hose to the host unit, so the heat physically leaves the phone.
Heat is released from a sealed metal micro-reservoir. The fan lives on the host unit only — never at the phone, never near the microphone.
Three granted patents
Covering utility models and a design patent. Holder: Shenzhen Aoshe Information Technology Co., Ltd.
Liquid-cooled heat sink
Patent ZL 2024 2 *******.6
Granted 2025-01-14
Tube body for a liquid cooler
Patent ZL 2024 3 *******.7
Granted 2024-12-17
Heat dissipation device
Patent ZL 2025 2 *******.3
Granted 2026-04-24
Tested, not claimed
Coolant compatibility
KOSTCHILL® PG25 propylene glycol coolant, tested to ASTM D1384 for material compatibility.