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21°C in 20 seconds

AOZAO L100

A 5,308 mm² cold plate bonds straight to the heat source. Semiconductor cooling plus a sealed liquid loop carries the heat away — and the cold head charges the phone wirelessly while it works.

AOZAO L100 phone cooler
20s to 21°C 5,308mm² cold plate 0dB at the cold head 15W wireless charging
Scroll for L100
2.7×Cold plate area versus comparable coolers
44.5WTotal system power draw
95cmLiquid hose length
Products

Two coolers.
One job: move the heat out.

Neither one blows air at your phone. Both bond a cold plate to the heat source and carry the heat away through a sealed liquid loop.

AOZAO L100 phone cooler
L100 · Flagship

Phone cooler for gaming
and long sessions

A semiconductor plate sits on a 3 mm copper sheet and spreads cold across a 5,308 mm² cold head. Heat leaves through a flexible hose into a sealed metal micro-reservoir. Snap it on and it starts; lift it off and it stops.

Semiconductor cooling Liquid loop Qi 15 W wireless charging 1.3″ OLED Magnetic mount
AOZAO K1 silent cooler
K1 · Streaming

Silent cooler built
for live streaming

Fan speed is controlled as a percentage so you can dial the noise down to whatever your microphone tolerates. Built for long broadcasts where a cooler that howls would be picked up on every take.

Adjustable fan speed Low noise Made for streaming
Why it works

Heat is moved,
not blown around

Active cooling

A semiconductor plate plus a liquid loop carries heat away instead of blowing it back at the device. The cold plate contacts the heat source directly.

0 dB at the cold head

No fan touches the phone. The only noise comes from the host unit's fan — roughly 50 dB at the unit itself, nothing at the cold head.

Cool and charge at once

Qi 15 W wireless charging is built into the cold head. Long sessions don't force a choice between a cool phone and a charged one.

Snap on, lift off

Magnetic mounting. It powers on when it attaches and off when you lift it. No buttons to reach for mid-game.

How it works

A complete heat path,
in four steps

Using the L100 as the example — from the semiconductor plate to heat leaving the unit.

01 Semiconductor cooling

A Peltier plate gets cold on one side and hot on the other. The cold side meets the copper sheet; the hot side goes to the cooling end.

02 Copper spreads the cold

A 3 mm copper sheet spreads the cold across the full 5,308 mm² contact area, so the whole back of the phone cools evenly.

03 Liquid carries it away

A micro pump pushes coolant through a flexible 95 cm hose to the host unit, so the heat leaves the phone entirely.

04 Sealed reservoir + fan

Heat is released from a sealed metal micro-reservoir, with a fan on the host unit only — away from the phone and away from your microphone.

Contact

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